Semiconductor packaging has evolved from traditional 1D PCB designs to cutting-edge 3D hybrid bonding at the wafer level. This advancement allows for interconnect pitches in the single-digit ...

SAN JOSE, California – Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to ...

2.5D/3D-ICパッケージでは、実際の製造に進む前にチップに生じる課題の把握、解決のためにチップ設計に信頼性の高い信号と構造の完全性、および信頼性の高い配電が含まれていることを検証するための適切なマルチフィジックス解析ツールを必要とされているが、この課題は、より高密度化が進むことで電磁界の問題が複雑化していくこととなり、その把握が重要と ...

2.5D/3D集積技術における相互接続密度の継続的なスケーリングにより、内部I/OインタフェースにESD保護回路を実装する余地が ...

For 2.5D packaging, achieving high bandwidth relies on the redistribution layer (RDL) within the package, where features like Line/Space (L/S), via, and pad dimensions are important. However, ...

Austin, May 14, 2025 (GLOBE NEWSWIRE) -- 3D IC and 2.5D IC Packaging Market Size & Growth Insights: According to the SNS Insider Report, “The 3D IC and 2.5D IC Packaging Market was valued at USD 51.81 ...

Have you ever felt that reality is deeper than what meets the eye? That perhaps our everyday experience is just the surface of something far more expansive? You're not alone. As humanity collectively ...