SAN JOSE, California – Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to ...

Alphawave Semi has announced the successful tape-out of its latest ultra-high-speed connectivity technology, marking a major ...

2.5D/3D IC designs present new challenges in both ESD design and verification. Advanced automated ESD verification methodology accurately and effectively evaluates ESD protection in 2.5/3D IC designs.

A new technical paper titled “Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges” was published by researchers at the University of California, Santa Barbara and Columbia ...

The Deep 3D is Coxem’s latest innovation designed to revolutionize the way SEM images are viewed and analyzed. By capturing a single BSE image, Deep 3D reconstructs a 3D image with depth and texture.