Abstract: This paper presents a 1.2e-, 3D-stacked CMOS image sensor (CIS) for mobile applications. A key motivation for using a stacked configuration is to minimize the chip area. Also, since numerous ...
Abstract: This paper presents a fully integrated CMOS humidity sensor for a smart RFID sensor platform. The sensing element is a CMOS-compatible capacitive humidity sensor, which consists of top-metal ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback