This new interposer platform provides a low-cost path for 2.5D/3D memory and logic integration that has been verified for quality, reliability, and mass production.

GUC provides 2.5D and 3D multi-die APT platform solution for AI, HPC, Networking ASICs To learn more about GUC's HBM3/2E, GLink IP portfolio and InFO_oS, and CoWoS ® total solution, please contact ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles for low-risk, high-yield production of ASICs with TSMC 2.5D and 3D Advanced ...