Silicon-based electronics are approaching their physical limitations and new materials are needed to keep up with current technological demands. Two-dimensional (2D) materials have a rich array of ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Researchers at the Institute of Physics in Zagreb, Croatia, in collaboration with international partners, have showcased new methods for visualizing atomic-scale changes in advanced materials. How do ...