The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

With 3D-ICs come new design and verification challenges that must be addressed to ensure successful implementation.

Mirabilis Design offers full support for System-level UCIe IP & architecture exploration platform for early Chiplet package design for a range of applications SANTA CLARA, CALIFORNIA, UNITED STATES, ...

KillPixel's shooter demonstrates breathtaking ambition in its 3D level design, but that can come at the cost of pacing and fun. Like a demon summoned by fresh blood on its altar, Wrath: Aeon of Ruin ...

Golf club manufacturing isn’t just about forging, casting and a guy in an apron grinding a wedge by hand anymore. The game is evolving, and so are the tools. Two of the most exciting technologies ...

Machine Design looks at the Q1 2025 analysis from the global market intelligence firm Context, which covers entry-level, industrial, mid-range and professional 3D printers. The global 3D printer ...