Alphawave Semi has announced the successful tape-out of its latest ultra-high-speed connectivity technology, marking a major ...

Austin, May 14, 2025 (GLOBE NEWSWIRE) -- 3D IC and 2.5D IC Packaging Market Size & Growth Insights: According to the SNS Insider Report, “The 3D IC and 2.5D IC Packaging Market was valued at USD 51.81 ...

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced ...

Traditional system-in-package (SiP) approaches, where semiconductor chips are arranged in a two-dimensional plane (2D) using solder bumps, have size-related limitations, warranting the development of ...

In October 2010 Xilinx announced its use of a 2.5D through-silicon via (TSV) approach for their Virtex-7 FPGAs. This was followed by announcements from TSMC, Samsung, Nokia, Micron, and Elpida about ...

A new technical paper titled “Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges” was published by researchers at the University of California, Santa Barbara and Columbia ...

Two software tools, Innovator3D IC and Calibre 3DStress, address chiplet integration and thermal management at the transistor level. Siemens Digital Industries Software announced the duo at DAC 2025.

DEAR BONNIE: I have been hearing about moving into a 5D world of consciousness, and I am not sure exactly what that entails, but I am noticing a difference in my attitude about what is acceptable and ...