VLSIシンポジウム 2024におけるプロセス・デバイス技術分野(従来のVLSI Technology Symposium)の採択論文数は95件。そのうち、今回はデバイス・プロセス部門の注目論文の最後として高密度2.5D実装および3Dトランジスタ垂直積層に向けた3件の取り組みを紹介する。

DEAR BONNIE: I have been hearing about moving into a 5D world of consciousness, and I am not sure exactly what that entails, but I am noticing a difference in my attitude about what is acceptable and ...

A new technical paper titled “Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges” was published by researchers at the University of California, Santa Barbara and Columbia ...

Two software tools, Innovator3D IC and Calibre 3DStress, address chiplet integration and thermal management at the transistor level. Siemens Digital Industries Software announced the duo at DAC 2025.