Austin, May 14, 2025 (GLOBE NEWSWIRE) -- 3D IC and 2.5D IC Packaging Market Size & Growth Insights: According to the SNS Insider Report, “The 3D IC and 2.5D IC Packaging Market was valued at USD 51.81 ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI. The semiconductor companies and startups on the front lines of the AI chip ...

In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die architectures represents a significant leap forward. This approach, which integrates multiple chiplets ...

ANSYS Inc.’s ANSS flagship multiphysics analysis solutions are leveraged by Faraday Technology Corporation for the development of advanced designs for modern multi-die 2.5D/3D integrated circuits (ICs ...

In October 2010 Xilinx announced its use of a 2.5D through-silicon via (TSV) approach for their Virtex-7 FPGAs. This was followed by announcements from TSMC, Samsung, Nokia, Micron, and Elpida about ...