Abstract: Thermal simulation is a key step in validating the performance of chiplet-based 2.5D systems. However, when dealing with the temperature-dependent parameters, the global nonlinear iteration ...
Abstract: A review of recent studies on up-to-date IC shows that electromigration (EM) has become one of the major challenges for 2.5D and 3D chiplet heterogeneous integration (CHI) systems. However, ...
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