In 2014, 5D memory crystal technology set a Guinness World Record for being the most durable data storage material – a title ...

Combination of 3D silicon stacking and 2.5D packaging technology enables custom compute platforms with breakthrough performance ...

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking ...

PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D ...

SHANGHAI--(BUSINESS WIRE)--VeriSilicon (688521.SH) today announced that Actions Technology (688049.SH), a low-power AIoT fabless ...

Hanmi Semiconductor announced on September 10 that it will unveil two new pieces of equipment for AI semiconductors?the "2.5D ...