Nasdaq

Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology

Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...
Nasdaq

Ansys Collaborates with TSMC to Deliver Thermal Analysis Solution for 3D-IC Designs

The companies collaborated to deliver a comprehensive hierarchical thermal analysis solution for TSMC 3DFabric using RedHawk-SC Electrothermal TSMC enabled Ansys RedHawk-SC™ for power integrity (EM/IR ...