Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...

The companies collaborated to deliver a comprehensive hierarchical thermal analysis solution for TSMC 3DFabric using RedHawk-SC Electrothermal TSMC enabled Ansys RedHawk-SC™ for power integrity (EM/IR ...

ANSYS has launched a new open neutral file format to help electronic component manufacturers and their customers to easily share design models between different thermal simulation toolsets. The open ...

Abstract: This paper presents a numerical study of thermal performance on heatsink configurations for power electronic devices. The analysis was based on numerical modelling using the CFD software ...

Ansys PathFinder-SC™ electrostatic discharge (ESD) reliability analysis solution for point-to-point (P2P) and current density (CD) is certified for TSMC's N2 process technology To promote the cloud as ...

uPI achieves a 2X improvement in thermal cycle endurance for their semiconductor product packages with Ansys' multiphysics simulation solutions Ansys' predictive simulation insights enable uPI to ...

...and Flir Defense launches portable chemical detector for rapid narcotics analysis – including fentanyl. Perception engineers can leverage thermal imaging data with computer simulations. Improving ...