Ansys (ANSS) and TSMC deliver a high-fidelity multiphysics solution to address design challenges for artificial intelligence (AI), datacenter, cloud, and high-performance computing (HPC) chips The ...

Ansys (NASDAQ: ANSS) and Intel Foundry collaborated to provide multiphysics signoff solutions for Intel's innovative 2.5D chip assembly technology, which uses EMIB technology to connect the die ...

Ansys achieved certification of its advanced semiconductor design solution for TSMC's high-speed CoWoS ® and InFO 2.5 D and 3 D advanced packaging technologies Ansys' comprehensive suite of power ...

Ansys RedHawk-SC Electrothermal™ is an electronic design automation (EDA) platform that enables multiphysics analysis of 2.5D and 3D-ICs with multiple dies. It can perform thermal analysis with ...

Ansys' integration of NVIDIA Omniverse, a platform of APIs for developing OpenUSD - and NVIDIA RTX -enabled 3D applications and workflows, will deliver the real-time 3D-IC visualization of results ...

Ansys multiphysics platforms support TSMC's latest silicon technologies, enabling advanced semiconductor designs..

Ansys (NASDAQ: ANSS) today announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) ...

Ansys (NASDAQ: ANSS) achieved certification of its state-of-the-art multiphysics signoff solution for TSMC’s most advanced 3nm process technology. This enables mutual customers to satisfy key power, ...

Ansys (NASDAQ: ANSS) is collaborating with Supermicro and NVIDIA to deliver turnkey hardware, enabling unmatched acceleration for Ansys multiphysics simulation solutions. By leveraging the ...

PITTSBURGH , Jan. 19, 2015 /PRNewswire/ — ANSYS (NASDAQ: ANSS) announced today the launch of the industry's first global partner program for simulation channel partners, which will promote and support ...