Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

DALLAS--(BUSINESS WIRE)--Uptiq.AI, a leader in AI-powered solutions for the financial services industry, proudly announces its acquisition of UpSwot, a cutting-edge provider of financial data ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the world's first “8-in-1” proof of concept* (PoC) for ...

SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes, heterogeneous ...

Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology. In this regard, ...

In the age of digital transformation, machine learning (ML) is rapidly becoming a pivotal technology in various sectors. One of ...

As companies decarbonise to meet clean energy targets, and society’s dependence on electricity grows, energy storage will become an increasingly important technology to ensure continued grid stability ...