These and associated design issues are especially detrimental to video subsystems. Noise and cross-talk can result directly from ICs and other components, if the routing is not done cleanly. However, ...

This is the eleventh article in a series about my career experiences in the PCB design industry. During my relatively long ...

Editor's note: This article addresses the need for designers of printed circuit boards for nextgen ICs to be savvy about package ...

Abstract: Stacked die BGA has recently gained popularity in telecommunication applications. However, its board level solder joint ...

Abstract: The ball field design in a flip chip (FC) ball grid array (BGA) often becomes the determining factor for the package ...

ELECTRONICS: Aries Electronics recently added new BGA Switch-A-Pitch adapters that allow for smaller pitch devices to be used ...

Routing flash has EMI implications. Don’t rush. Memory comes in different types, and one key distinction is whether the memory ...