The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

The ball grid array packaging industry continues to expand as the demand for high-performance denser type compact packaging continues to rise. Electronic devices such as smartwatches, smartphones, and ...

The unparalleled pin density and low lead inductance of ball grid arrays (BGA) are essential in today’s high pin count, high frequency integrated circuits. However, that same pin density and unique ...

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...

TT Electronics subsidiary IRC Inc. now offers a high-speed digital-termination ball-grid-array (BGA) package designed to prevent signal theft in consumer electronics devices. The CHC series’ BGAs are ...