Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...

Abstract: Relatively little is known about the performance of the doped Ball Grid Array (BGA) packages used in semiconductor industries, even though newer products are widely being introduced to the ...

The unparalleled pin density and low lead inductance of ball grid arrays (BGA) are essential in today’s high pin count, high frequency integrated circuits. However, that same pin density and unique ...

Abstract: Flip chip ball grid array (FC-BGA) packages are preferred in high-performance computing and advanced packages because of their superior signal integrity, high input/output density, good ...