The Next-Gen Huawei Chip That Threatens Nvidia's Dominance: Insiders Reveal Ambitious Four-Die Packaging Design

Huawei has filed patents for a next-generation Ascend AI chip with a bold quad-die packaging design, a move insiders say ...
SiliconANGLE

Broadcom introduces 3.5D XDSiP chip packaging for data center processors

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...
Packaging Europe

From data to impact: Trayak’s Sustainable Packaging Intelligence Workshop

At this year's Sustainable Packaging Summit, taking place in Utrecht from 10th-12th November, Trayak will be hosting an ...

Anhui Dong'ou Machinery Obtains Patent for Electric Vehicle Lithium Battery Packaging Structure, Is a Significant Improvement in Range Expected?

Anhui Dong'ou Machinery Obtains Patent for Electric Vehicle Lithium Battery Packaging Structure, Which May Significantly Enhance Range. Anhui Dong'ou Machinery Technology Co., Ltd ...