As soon as the python version upgrade will go live all FEM on Colab packages will need to be rebuilt. Before the rebuilt is complete none of the FEM on Colab packages will be working, but users will ...

Abstract: Advanced integrated circuit (IC) systems increasingly utilize chiplet-based packaging with complex $2.5 \mathrm{D} / 3 \mathrm{D}$ structures and dense Through-Silicon Via (TSV) arrays.

Keysight Technologies Inc. has announced the latest release of Electromagnetic Professional (EMPro) software, its 3-D electromagnetic simulation software. EMPro 2015.01 offers a number of new ...