BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...

Preventing plating and soldering voids is about testing new manufacturing processes and analyzing the results. Plating and soldering voids usually have an identifiable cause, such as the type of ...

If you’ve spent any time at all laying out your own circuit boards we’re sure you’ve run into the issue of not having the right component or package available in the standard libraries. If it’s a ...

The TDD Series surface mount jumper DIP switches from C&K components are sealed with a removable top tape to enable them to be used in reflow soldering and washable assembly processes. The TDD Series ...

Solder pins have been the interface of choice for power modules for many years. New press-fit pins take the assembly properties of power modules a step further: the solder-less assembly of the modules ...

Horizon achieves breakthrough with solderable metallised AM parts, unlocking next-gen electronics integration. Read m ...