Siemens and TSMC deliver new certifications and design solutions for the foundry’s most advanced process technologies.

United Microelectronics, a global semiconductor foundry, and Cadence Design Systems, have announced that the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified ...

Speeding time to market, the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC platform, has been certified for UMC’s chip stacking technologies. UMC’s hybrid bonding solutions support the ...

Designing ICs on 0.13-micron and smaller process technologies poses tremendous challenges. The number of silicon failures caused by signal integrity problems is on the rise because existing design ...

IROC Technologies faced developing an integrated circuit (IC) - from scratch - with limited internal IC design resources. To meet the aggressive tapeout schedule, IROC needed to feel confident in the ...

The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...

Collaboration with Siemens illustrates TSMC's persistent focus to enable shared customers for the latest and most advanced ...

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

SAN DIEGO, June 06, 2022 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH ) ("GBT” or the “Company”), is researching the development of a machine learning-driven, automated integrated ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...