Micro-electro-mechanical systems have been available for years, and have been successful in selected high-volume applications. But MEMS design is not as organized as it could be. MEMS design typically ...

Santa Cruz, Calif. — At first glance, the Pilot Design Environment from Synopsys Inc. may sound like a resurrected EDA framework from the late 1980s. But Synopsys claims to be taking a fresh approach ...

HSINCHU, Taiwan--(BUSINESS WIRE)--SpringSoft, Inc., a global supplier of specialized IC design software, today announced the availability of the latest version of its Laker™ Advanced Design Platform ...

IROC Technologies faced developing an integrated circuit (IC) - from scratch - with limited internal IC design resources. To meet the aggressive tapeout schedule, IROC needed to feel confident in the ...

Siemens and TSMC deliver new certifications and design solutions for the foundry’s most advanced process technologies.

The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...

Collaboration with Siemens illustrates TSMC's persistent focus to enable shared customers for the latest and most advanced ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

SAN JOSE, Calif. & HSINCHU, Taiwan--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (UMC), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq ...

PITTSBURGH, Oct. 26, 2022 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC to certify that Ansys RedHawk-SC™ and Ansys® Redhawk-SC Electrothermal™ are compliant with TSMC's 3Dblox™ ...