This paper describes a new approach for chip design and system-level integration. A hierarchical RTL context-preserving insertion and connectivity methodology has been further implemented in EDA tool ...

AMITYVILLE, N.Y. – Speco Technologies has just announced a strategic partnership with JVSG to enhance design system software capabilities with a new IP-system design tool. The partnership combines ...

In this paper is presented the IPZip tool. A graphical wizard that allows the automatic distribution of SystemC TLM IP Cores based on the SPIRIT IP-XACT 1.2 standard. The main goal of IPZip is to ...

SNPS expands its TSMC partnership, advancing AI, SoC, and multi-die design with certified flows, IP, and 3DIC innovations.

Design teams are under pressure to integrate more functionality in less time. Structured metadata and automation help manage ...

Cadence Design Systems sells essential AI tools in a three-firm EDA oligopoly, with strong growth from systems and IP ...

AMITYVILLE, N.Y. – Speco Technologies has just announced a strategic partnership with JVSG to enhance design system software capabilities with a new IP-system design tool. The partnership combines ...

Today’s semiconductor designs support a broad range of applications, from mobile and edge devices to AI accelerators and data center systems. To keep pace, design teams are shifting from monolithic ...

This collaboration aims to combine Speco Technologies’ expertise in video surveillance technology with JVSG’s innovative IP system design tool, creating a comprehensive and user-friendly platform.

Cadence Design Systems is rated Hold amid strong growth, high valuation, and rising Synopsys competition. Click here to find out why CDNS is a Hold.

Energy efficiency is one of the primary design metrics for heterogeneous multi-core mobile platforms, and the very real threat of dark silicon reinforces the fact that we must manage energy ...

There are a number of system design factors requiring consideration when implementing an FPGA processor. Some of those factors include the use of co-design, processor architectural implementation, ...