Forward-looking: TSMC and Samsung have been attempting to leapfrog one another in terms of extreme ultraviolet lithography. After years of waiting, it seems the industry is finally making strides with ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its digital full flow and custom/analog tool suites have been further enhanced to deliver optimal ...

Global Unichip Corp (GUC), the advanced ASIC leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric advanced packaging technology for AI, HPC, and networking ...

TSMC has also come up with a 5-nanometer design infrastructure, which can be employed for future chip designs. Earlier speculation suggested it could be used in the "A14" chips for the 2020 iPhones, ...