Low-Profile Package Provides Enhanced Performance and Flexibility for Mission-Critical Military and Aerospace Designs MOUNTAIN VIEW, Calif., July 7 /PRNewswire ...

Land Grid Array capacitors from AVX have achieved, thanks to patented design innovations, the equivalent high-frequency performance of complex 8-terminal Inter- Digitated Capacitors in a simple ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Cobar Europe has taken on distribution of SMT 158 capillary underfill and SMT 256 individual solder joint encapsulations produced by Yincae Advanced Materials. In a release, Yincae notes SMT 158 ...