In October 2010 Xilinx announced its use of a 2.5D through-silicon via (TSV) approach for their Virtex-7 FPGAs. This was followed by announcements from TSMC, Samsung, Nokia, Micron, and Elpida about ...

I see a lot of articles bouncing around the Internet these days about 2.5D and 3D ICs. One really good one that came out recently was 2.5D ICs are more than a stepping stone to 3D ICs by Mike ...

DEAR BONNIE: I have been hearing about moving into a 5D world of consciousness, and I am not sure exactly what that entails, but I am noticing a difference in my attitude about what is acceptable and ...

A new technical paper titled “Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges” was published by researchers at the University of California, Santa Barbara and Columbia ...

3D printing technology has already transformed the field of biomedical research by allowing scientists to produce soft tissue, replacement windpipes, and working hearts on a whim. But each of these ...

Two software tools, Innovator3D IC and Calibre 3DStress, address chiplet integration and thermal management at the transistor level. Siemens Digital Industries Software announced the duo at DAC 2025.