SAN JOSE, Calif., July 27, 2022 /PRNewswire/ -- NEO Semiconductor, a leading developer of innovative architectures for NAND flash and DRAM memory, today announced the release of its second-generation ...

Micron Technology recently unveiled 176-layer, triple-level-cell (TLC), 3D NAND flash memory with a 30% smaller die size that employs a new replacement-gate (RG) NAND technology. The chips offer a 35% ...

As our use of mobile technology increases, so does our demand for more built-in device storage capacity in smaller and smaller form factors. Only a few weeks have passed since Intel began using its 25 ...