Indium Technical Support Engineer Carson Burt will deliver a technical presentation on solder paste best practices.

This new technical paper titled “End-to-end deep learning framework for printed circuit board manufacturing defect classification” is from researchers at École de technologie supérieure (ÉTS) in ...

Indium Corporation technical support engineer Carson Burt will deliver a technical presentation on solder paste best practices at the SMTA Empire Expo and Tech Forum, to be held October 1 in East ...

Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...

In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...

After the Shanghai Tong'er technical team assisted in correcting the files by adding pad tolerance markings (±0.02mm) and optimizing the opening design, the defect rate was reduced to 0.8%. The PCB ...

Carson Burt, a technical support engineer at Indium Corporation, will deliver a technical presentation on solder paste best ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

According to the latest information from the National Intellectual Property Administration, Disen Circuit Board (Shenzhen) Co., Ltd. applied for a patent titled "Optimization Method for Real-Time ...

PEMTRON announces its participation at the TPCA Show where it will highlight two of its most advanced inspection solutions.

Manufacturers of advanced PCB assemblies know that simultaneously producing cost-competitive products and meeting the quality expectations of customers are vital to their success. Driven by advancing ...