EDN

SMT Assembly and PCB Design Guidelines For Leaded Packages

This application note provides the PCB design and SMT assembly guidelines for Maxim Integrated’s leaded packages (SOIC, TSSOP, QSOP, QFP, SC70, SOP, SOT, etc.). Leaded packages are surface-mount ...
Electronics Weekly

Whitepaper: NCAB – Maximise your PCB design for production and performance

There is a new resource available in the site: a whitepaper from NCAB. It considers how best to maximise the design of your PCB for both manufacture and best performance, in order to make the right ...
Electronic Design

Via-In-Pad Guidelines for PCBs

Though generally frowned upon, here’s a quick rundown on why “via in pad” may be an option to consider in certain designs, and how to place them properly. Via in pad seems to be one of the hot topics ...
EDN

Layout Guidelines for RF and Mixed-Signal PCBs

This application note provides guidelines and suggestions for RF printed-circuit board (PCB) design and layout, including some discussion of mixed-signal applications. The material provides “best ...
Electronic Design

PCB Designers Need to Know These Panelization Guidelines (.PDF Download)

This article provides common-sense printed-circuit-board (PCB) processing edge and array guidelines that should give most assemblers a good chance at efficiently populating the PCB assemblies (PCBAs) ...