The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...

Aikido Security Ltd. today disclosed what is being described as the largest npm supply chain compromise to date, after ...

A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...

This application note presents the use of FIT or Firmware Integration Technology for board support package module. The document describes the overview, the features, configuration, API information and ...

ROHM has developed the DOT-247, a 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx) Ideal for industrial applications such as ...