Abstract: The growth of the Intermetallic Compound (IMC) layer is essential for the mechanical reliability and performance of solder joints in electronic devices. This study investigates how elevated ...
Abstract: The interfacial intermetallic compound (IMC) is a crucial factor for solder jointing reliability assessment and a suitable IMC layer size guarantees the quality of solder joints. On one hand ...
Put away that hot iron, and stow the solder: you can now forge a connection between two bits of metal at room temperature. Soldering is a mainstay of the microelectronics industry, which uses hot ...
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