Semiconductor Engineering

Thermal, Mechanical, And Material Stresses Grow With Die Stacking

In any multi-die assembly, stacking two or more active dies results in thermal stress. Heat dissipated from a lower die faces ...

[Gyeongju APEC] Naver CEO Choi Soo-yeon: "AI Data Centers Are Essential for Building Full-Stack AI"

Choi Soo-yeon, CEO of Naver, attended the 2025 Asia-Pacific Economic Cooperation (APEC) CEO Summit and emphasized the need to establish support ...