Fibocom, a leading global provider of wireless communication modules and AI solutions, introduced its new series of 5G FWA solutions powered by the MediaTek T930 platform. The lineup includes the ...

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Abstract: To address reliability challenges from high integration of 5G/6G RF front-end microsystems, this study optimizes electrothermal performance and predicts solder joint fatigue life in 3D ...

C tool with 125 MS/s sampling—perfect for fieldwork, classrooms, or your desktop Compact, cost-effective i.MX 91 development board optimized for embedded Linux development Building an indoor ...

LoginForgot password?Send Reset LinkBack to login. 1.15. Overview of low-loss materials for phased array substrate 1.16. Dk and Df comparison of material for phased array substrate 1.17. Other ...