Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...

The neutral atom array architecture for quantum computing has been rapidly advancing over the last several years, and a recent study published in Nature has just revealed another step forward for this ...

Stochastic dynamical systems arise in many scientific fields, such as asset prices in financial markets, neural activity in the brain, or the spread of infectious diseases. Petar Jovanovski's Ph.D.