Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Abstract: To address the challenges of wide-angle scanning and low sidelobe level (SLL) requirements in satellite communication systems using wideband large-scale array antennas, this paper proposes a ...
Long lines, delays and record passenger numbers might not scream “satisfaction,” but while these remain frequent hallmarks of air travel in North America, a new study has revealed flyers are ...
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